Thanks to its innovative technology and unique features, major companies have chosen the TDM system in electronics and semi-conductors for both quality control and R&D purposes. Our customers acknowledged the technical advantages of the TDM system, such as the high resolution sensor, the versatility of the system, and its user friendliness.

The TDM is a versatile instrument for a wide array of applications in the areas of process development, failure analysis, reliability, and quality control.

Component Reflow

BGA Apps Briefing
PCB

PCB Apps Briefing
Solder Ball Coplanarity

Bumps Apps Briefing
Sockets

CPU Socket Apps Briefing
Connector

Connector Apps Briefing
Wafer

Wafer Apps Briefing
Power Module

IGBT Apps Briefing
Panel

Panel Apps Briefing
Panel Level Package

PLP Apps Briefing
Strips

CSP Strip Apps Briefing
Multi - Scale

Multi-Scale Functionality
CTE + Strain

CTE + Strain Apps Briefing
Subroom

Neg Temp Apps Briefing

Let us show you the unique capability and functionality of the TDM system. Request a free sample analysis today!

Warpage capability at a glance

-65 to 400°C
Top and bottom heating
Heating ramp up to +6°C/s

Z resolution <1µm
Ultra high camera resolution
Measurement of discontinuities

Full field acquisition in <1s
Samples up to 800mm x 600mm
Automatic post processing

Why tdm?

Fast Heating and Cooling

Camera Resolution

Top and Bottom Heating

Available Sample Thickness

Measure Absolute Value

Advanced set of 3D software

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Réalisé et hébergé par Mezcalito