Have you ever encountered an error code while synchronizing to your cloud base drive? Cloud base data centers are prone to component-level thermal degradation and decomposition. Therefore, these data centers will have high expenditure on thermal management solutions. Staying Cool is one of the critical components for servers to remain operational and keep your cloud data safe.

Another essential factor happens when these devices are in the development stages from the material selection, which will synthesize favorably for their thermos-mechanical behavior, board designs, and parts placement for hot spot prevention. All essential packages used in server development will undergo thorough thermal warpage evaluations.

TDM will play its role in the thermal performance of these devices in keeping your data safe. We produce insightful results to the kinematic response of the packages while undergoing temperatures up to 400°C.

We present a case of warpage evaluation for populated PCBs.