TDM Compact 3 : Full modularity and flexibility
Warpage measurement on µm scale from -65°C to 400°C
Independently controlled top/bottom heater banks
Fast heating and cooling ramp
Ultra high resolution camera for fine feature analysis
Sample drawer for easy sample loading
The TDM Compact 3 is a versatile instrument for a wide array of applications in the areas of process development, failure analysis, reliability, and quality control. TDM-Compact acquires an entire, absolute 3D cartography of devices with dimensions up to 300 mm x 375 mm. Simultaneously, its powerful heating and cooling capabilities allow for virtually any temperature profile on the sample under test. With the scanning and multi-scale option.
TDM XL : Large size and large sample capability
Warpage measurement on µm scale of object up to 800 x 600 mm
Independently controlled top/bottom heater banks
Fast heating and cooling ramp
Ultra high resolution camera for fine feature analysis
Sample drawer for easy sample loading
The TDM XL complements the TDM Compact. The first generation of TDM was designed for surface analysis of relatively small area (up to 150x150 mm) while the TDM Large Scale offers surface inspection of areas up to 800 x 600 mm. Therefore, the thermo-mechanical analysis of boards, wafers, and another large object becomes possible. With the scanning and multi-scale option.
TDM Table Top: Self-contained, fluid-free, and easily fits on a bench-top
Warpage measurement on µm scale from room temperature to 300°C
Independently controlled top/bottom heater banks
Fast heating and cooling ramp
Ultra high resolution camera for refined feature analysis
Sample drawer for easy sample loading
The TDM Table Top is an affordable solution for the lab environment. It is compact, self-contained, fluid-free, and easily fits on a bench-top. TDM TT does not require compressed air or exhaust.
TDM Compact 2: Full modularity and flexibility
Warpage measurement on µm scale from RT to 300°C
Independently controlled top/bottom heater banks
Fast heating and cooling ramp
Ultra high resolution camera for fine feature analysis
Sample drawer for easy sample loading
The TDM Compact 2 is a versatile instrument for various applications in process development, failure analysis, reliability, and quality control. TDM-Compact acquires a complete, absolute 3D cartography of devices with dimensions up to 310 x 230 mm (field of view up to 150 x 150 mm). Simultaneously, its powerful heating and cooling capabilities allow for virtually any temperature profile on the sample under test.
TDM RT-3D Sensor
This flexible platform provides warpage measurement on µm scale all at room temperature
TDM RT-3D Sensor offers the ability to produce high resolution topography measurements
The highly customizable RT-3D Sensor units can inspect the topography of your device as well as the ability to detect a variety of surface feature defects.
These effective systems are suitable for the majority of applications to the most challenging, complex of devices.
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Contact us© INSIDIX - 14 Rue Henri Dunant - 38180 Seyssins - France - +33 (0)4 38 12 42 80 - insidix@insidix.com
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